3HAC9313-1 ABB

G50677 FK Delvotec 6320 Bonder System N54212 Asymtek A-618C Millennium Dispensing System N66395 Hitachi S-2300 Scanning Electron Microscope N59111 Electroglas 20001CXE 6” Wafer Prober 2001CX C69224 K&S 4522 Multi-Process Gold Wire Ball Bonder A73230 Beckman P/ACE MDQ Capillary Electrophoresis Sys N55921 YES Yield Eng. YES-5 Vapor Prime Oven Yes5 A73251 Kodak Image Station 4000MM Pro Imaging System N70686 Multiline Technology Optiline Post X-Ray Machine C59242 Electroglas 3001X 8″ Wafer Prober Probe Station

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Description

Heidenhain Maßstab LS803D ML370 (LS 803D 803 D ML 370) Austausch inkl. 12 Monate Garantie Heidenhain Maßstab LS803D ML320 (LS 803D 803 D ML 320) Austausch inkl. 12 Monate Garantie Heidenhain Maßstab LS803D ML920 (LS 803D 803 D ML 920) Austausch inkl. 12 Monate Garantie Heidenhain Montageanleitun​gLS 803 LS 803D LS903 Nr.9066 Heidenhain Montageanleitun​gLS 803 LS 803D LS903 Nr.9065 Heidenhain Montageanleitun​gLS 803 LS 803D LS903 Nr.9329 Heidenhain Montageanleitun​gLS 803 LS 803D LS903 Nr.9798 C52781 Sloan Dektak V300-Si 12″ Wafer Surface Profiler C73574 MRSI 505 Assembly Work Cell Pick & Place System K69474 Logitech LP50 Precision Lapping & Polish. System C54479 Jeol JSM-IC848 Scanning Electron Microscope C73914 Varian Unity Inova 500 NMR Spectrometer System C71289 Micrion 9100 Focused Ion Beam FIB Milling System A73002 Caterpillar D80-6 Generator 100 kVA 80 kW, CAT C69679 K&S 4524AD Digital Manual Ball Wire Bonder 3HAC9313-1 ABB A73921 Shimadzu LCMS-2010A Mass Spectrometer C72437 Finnigan MAT 8230 Mass Spectrometer N69528 Logitech PM5 Lapping Polishing System IPM5 A71781 TA Instruments AR 2000ex Advanced Rheometer C68069 HP 83000 Digital Test System Model F660 G52281 Nanometrics Nanospec 9000 Film Analysis System G40450 ADE Technologies Polar Kerr System A69510 Logitech 1WBT2 Wafer Substrate Bonder, 3 Station G69555 Logitech 1WBS2 Wafer Substrate Bonder Enlarge G54625 Asymtek A-612C Dispensing System