Description
C70442 Westbond 7700A Ultrasonic Ball & Wedge Bonder C71219 Westbond 7416A Thermocompression Ribbon Bonder A69438 Applied Materials 8300 Plasma Etch Chamber/Parts C68471 Signatone CAP-463 Computer Aided 6″ Wafer Prober C69868 Westbond 7416A Thermocompression Wedge Bonder C69867 Westbond 7700A Deep Access Ball & Wedge Bonder C64997 Westbond 7416A Thermocompression Wedge Bonder C70110 Westbond 7700A Deep Access Ball & Wedge Bonder C70147 Westbond 7200B Pick & Place Epoxy Die Bonder A52245 Inficon UL500 Dry w Tri-Scroll Pump, Leybold A52247 Inficon UL500 Dry Leybold, Anest Iwata Vac Pump A63189 Crest Ultrasonics Cleaning Station w/ Robotic G53925 Olympus Measuring Microscope System A72283 (3) Tokyo Electron P-8XL Wafer Probers, P-8 C30694 Dage Microtester 22 Wire Shear/Pull Tester BT22 L70134 Kensington Zeiss Wafer Inspection Station G73241 Waters Alliance 2695 Separations Module GE43031 Tesec 9210-IH Ambient/Hot IC Handler GE43128 Tesec 9210-IH.T Ambient/Hot IC Handler GE43127 Tesec 9210-IH/T Ambient/Hot IC Handler 
GE43074 Tesec 9210-IH.T Ambient/Hot IC Handler GE43073 Tesec 9210-IH Ambient/Hot IC Handler C50941 Electroglas Horizon 4085X Automatic 8″ Prober C69771 Westbond 7316A Eutectic Mech. Scrub Die Bonder C69694 Westbond 7316A Multiple-Collet Scrub Die Bonder C69695 Westbond 7300A Eutectic Ultrasonic Die Bonder C52697 Aetrium 5050S IC Handler for .208mil SSOP N66463 Signatone S-1160 Prober Probing Station w/SZ4045 C50995 Isel Robotik Wafer Handling Robot Newly Upgraded C70446 Mech-El 907 Manual Wedge Wire Bonder A55030 Boc Edwards QMB250F Booster w QDP40 Dry Pump A55032 Boc Edwards QMB250F Booster w/ QDP40 Pump
